SUDDEN AND PARAMETRIC FAILURES IN MICROELECTRONIC COMPONENTS: MECHANISMS, CLASSIFICATION AND METHODS OF RELIABILITY ASSURANCE
Authors:
1.
Voronezh State University of Forestry and Technologies named after G.F. Morozov
2.
Voronezh State University of Forestry and Technologies named after G.F. Morozov
Russian Federation
Russian Federation
3.
Voronezh State University of Forestry and Technologies named after G.F. Morozov
Russian Federation
Russian Federation
Type:
Сonference article
Pages:
from 1348
to 1355
Published:
30.06.2026
Subject area:
UDC 004
Language:
Russian
Keywords:
sudden failures, parametric failures, reliability, degradation of parameters, functional testing, fault tolerance
Abstract:
The article discusses two main types of failures of microelectronic components and information systems - sudden and parametric. A classification of failures is given according to the nature of parameter changes, the degree of impact on functionality, the relationship with other failures and the time of occurrence. The physical mechanisms of sudden failures (electromigration, dielectric breakdown, corrosion, mechanical damage, etc.) and gradual (parametric) degradation mechanisms are described in detail.
The article discusses two main types of failures of microelectronic components and information systems - sudden and parametric. A classification of failures is given according to the nature of parameter changes, the degree of impact on functionality, the relationship with other failures and the time of occurrence. The physical mechanisms of sudden failures (electromigration, dielectric breakdown, corrosion, mechanical damage, etc.) and gradual (parametric) degradation mechanisms are described in detail.
Keywords:
sudden failures, parametric failures, reliability, degradation of parameters, functional testing, fault tolerance
sudden failures, parametric failures, reliability, degradation of parameters, functional testing, fault tolerance
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